Equipping Innovation
With over 35 years of excellence in manufacturing, AJA International, Inc. is fueling a global golden age of innovation in the world of thin film coating & deposition.
WELCOME TO AJA INTERNATIONAL, INC.
AJA is a manufacturer of thin film deposition systems including magnetron sputtering, e-beam evaporation, thermal evaporation, and ion milling systems. Founded in Scituate, MA, USA in 1989 by William Hale, MBA, BS Physics, the company was established as a supplier of innovative physical vapor deposition (PVD) products. With many systems and magnetron sputter sources shipped worldwide, AJA International, Inc. continues to discover innovative design solutions which are often copied but never equaled. The company truly remains the cutting edge in thin film technology.
SPUTTERING
SYSTEMS
ION MILLING
SYSTEMS
HYBRID
SYSTEMS
EVAPORATION
SYSTEMS
SPUTTERING
SOURCES
SUBSTRATE
HOLDERS
WHAT’S NEW AT AJA
ATC-MC Multi-Chamber Deposition Tool with UHV Transfer Tube & Load-Lock
The ATC-HY Multi-Chamber Deposition System features two Magnetron Sputtering Process Chambers, each dedicated to metal and oxide deposition. Each chamber is equipped with a confocal sputter source configuration, capable of handling 4” wafers, substrate heating up to 1000°C, azimuthal rotation, and RF biasing. These deposition chambers are interconnected via a UHV Transfer Tunnel, allowing for in-situ wafer transfer at vacuum levels below 10⁻⁸ Torr. Additionally, the load-lock chamber includes a degas station, which can heat substrates up to 200°C before they enter the UHV transfer tunnel. The flexible design of the UHV Transfer Tunnel allows for future expansion, either in a linear or right-angle orientation, and supports integration with both AJA and non-AJA systems.
WHAT’S NEW AT AJA
The ATC-1800 UHV Electron Beam Evaporation System with Load-Lock and Appendage Chamber
This ATC-MC Multi-Chamber System has a unique combination of capabilities. The main deposition chamber includes a UHV 6-Pocket 15cc Linear Electron Beam Gun, and 4” motorized tilting (+/- 180 degrees) substrate holder with LN2 cooling capabilities. The load-lock system at natural static oxidation capabilities ranging between 5-100 Torr.
The custom appendage chamber has sample cleaning and analytical capabilities. For sample cleaning the chamber is equipped with substrate heating to 850C for sample degas, and a Hydrogen Atom Beam Source (HABS). The HABS is a thermal gas cracker that produces an absolutely ion-free hydrogen gas beam, avoiding ion induced damage to the substrate. For analytics the chamber is equipped with a HIDEN Temperature Desorption Probe (TPD/TDS). The TDS includes a triple filter mass analyzer configured with a cooled shroud giving the analyzer optimum sensitivity with minimum background contributions to accurately read contaminates being desorbed from the sample surface. In addition, the chamber is equipped with a RHEED and AUGER system from STAIB Instruments. When used in combination this will provide a wealth of complementary structural and chemical information to optimize thin film fabrication and better control of material properties.
WHAT’S NEW AT AJA
ATC-MC Multi-Chamber Magnetron Sputtering System with Cassette Loading and Automated Transfer Capabilities.
The ATC-MC Multi-Chamber Magnetron Sputtering System allows automated in-situ transfer between two UHV deposition chambers each equipped with (5) 3” con-focal sputtering sources, (1) 6” direct sputtering source, and (1) 4cm gridded DC ion source. Sputtering sources are powered by DC, RF, and HiPIMS generators.
System is designed for up to 8” wafer handling, 800C heating, 0-40 RPM azimuthal rotation, RF/DC biasing, and 100mm z-motion adjustment. Additional features include custom bakeout jacket for chamber conditioning (< 9.0x10-10 Torr), turbo/cryo pump combination, automated crystal monitor positioning for rate calibration and data logging, and post wafer cooling via He gas.
WHAT’S NEW AT AJA
ATC-2200-HY UHV Hybrid Deposition System with XPS integration
The ATC-2200-HY Hybrid Deposition system is equipped with (5) 2” con-focal sputtering sources, (1) 3” direct sputtering source, (1) 6-pocket 15cc linear electron beam gun, and (1) 4cm gridded DC ion source. The system is designed to accommodate up to 3” wafer handling, 850C heating, azimuthal rotation, RF/DC biasing, 100mm z-motion, and in-situ mask exchange mechanism. In addition the system has an appendage chamber that allows the user to disengage the mask, flip the substrate 180 degrees, and in-situ transfer into an XPS system for chemical and elemental analysis.
